Advanced technology of epoxy molding compounds production and strength characteristics of developed epoxy molding compounds

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds

Please cite this article in press as: Schreier-Alt T pounds. Microelectron Reliab (2010), doi:10.10 This paper presents new experimental and numerical methods to characterize the transfer overmolding of substrates with epoxy polymer. We investigated Multi Chip Modules on ceramic panels as well as on printed circuit boards encapsulated as a Mold Array Package (MAP). Experiments show that the pol...

A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds

Volumetrical Characterization of Sheet Molding Compounds

For a comprehensive study of Sheet Molding Compound (SMC) surfaces, topographical data obtained by chromatic confocal imaging were submitted systematically for the development of a profile model to understand the formation of cavities on the surface. In order to qualify SMC surfaces and to predict their coatability, a characterization of cavities is applied. To quantify the effect of surface mo...

A coarse-grained model for epoxy molding compound.

We present a coarse-grained model for molecular dynamics simulations of an epoxy system composed of epoxy phenol novolac as epoxy monomer and bisphenol-A as the cross-linking agent. The epoxy and hardener molecules are represented as short chains of connected beads, and cross-linking is accomplished by introducing bonds between reactive beads. The interbead potential, composed of Lennard-Jones,...

Stress Relaxation in Plastic Molding Compounds

Viscoelastic materials for plastic encapsulated molding compounds invariably exhibit a time-dependent stress response to an imposed constant strain, which is called stress relaxation. Stress relaxation tests with molding compounds used to encapsulate microcircuits have been performed to measure the time dependent non-linear constitutive relation between stress and strain as a function of temper...